The gold/germanium alloy is used commonly for soldering for semiconductors. Because of its high melting point it is ideal to be used at the elevated operating temperatures of smaller dies, with increased power densities. A die is a specialized tool used in manufacturing industries to cut or shape material mostly using a press. Gold-based solders have a melting point ranging from 280-1064°C, making them compatible with subsequent reflow processes. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint.
Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Eutectic refers to a mixture of two or more components in such proportion that their combined melting point is the lowest attainable, in some cases as low as 60°C. Eutectic alloys are fusible, this means that upon cooling they convert from liquids to mixed solids.